Qualcomm has taken a significant step forward in the edge computing sector with the launch of two new processors bearing its Dragonwing brand. These are the Q-2390 and IQ-2390 models, two platforms that, while sharing the same underlying architecture, are designed to address very different needs within the Internet of Things (IoT). The company aims to enable manufacturers to integrate artificial intelligence, computer vision, connectivity, and security into a wider range of devices without having to contend with the added costs and technical complexities that this has entailed until now.
The presentation comes just before IFA 2026, a perfect showcase to unveil its new offerings to the world. With these chips, the company aims to break down some of the barriers that still hinder the adoption of AI in everyday products and industrial environments. The idea is for devices to be able to process data locally, instead of always relying on the cloud, which is especially useful in sectors where speed and reliability are critical. As Jeff Arnold, vice president and general manager of Auto Telematics & Industrial & Embedded IoT Consumer and Connectivity at Qualcomm, explains, many product categories still face challenges related to cost, complexity, and integration, and with this new family of processors, they want to change that dynamic.
Dragonwing Q-2390: AI is coming to consumer and commercial devices
The Q-2390 is designed for commercial, enterprise, and consumer products that require on-device processing capabilities but with very tight constraints on cost, power consumption, and size. This processor integrates application processing, on-device AI, camera and display support, LTE Cat 4 connectivity, and GPS positioning onto a single chip. With this, Qualcomm aims to enable developers to create a new generation of connected products capable of sensing their environment, analyzing data, and acting accordingly, all without relying on a constant cloud connection.
Common applications for this chip include point-of-sale systems, interactive kiosks, access control devices, smart home appliances, robotic cleaners, fitness equipment, smart farming solutions, and enterprise terminals. Integrating all these components onto a single platform allows manufacturers to reduce the number of parts required to develop their products, resulting in simpler and more cost-effective designs. Furthermore, by streamlining the design process, time to market is accelerated, which is always a competitive advantage in the tech world.
Dragonwing IQ-2390: the all-terrain brother for the industry
On the other hand, the IQ-2390 is the first processor in Qualcomm's new IQ2 series, a family created to extend AI computing to more compact and demanding industrial systems. This chip adapts the same technological foundation as the Q-2390 to environments with much harsher working conditions. It is designed for applications such as building automation, industrial vision systems, human-machine interface (HMI) panels, programmable logic controllers (PLCs), gateways, and energy management solutions. One of its most notable features is the inclusion of two Gigabit Ethernet connections with support for Time-Sensitive Networking (TSN), a technology that enables deterministic, real-time communication, essential in industrial environments.
But the key difference with the Q-2390 is its ruggedness. The IQ-2390 has been designed to withstand extreme temperatures ranging from -30°C to 115°C, and is also built to withstand vibrations and shocks. This makes it an ideal choice for ruggedized equipment installed in factories, energy infrastructure, outdoor industrial environments, and sectors such as oil and gas and utilities. Like its smaller sibling, this processor also aims to simplify system design by reducing the bill of materials, the space required on boards, and the complexity of integrating different components. All of this is intended to enable manufacturers to offer more reliable solutions with a longer lifespan.
Same technical basis, two different approaches
Both processors share a common technical core that includes a quad-core Qualcomm Kryo CPU, an Adreno 704 GPU, and a RISC-V microcontroller for real-time processing. Support for operating systems such as Linux, Android, and Zephyr OS gives developers great flexibility to create differentiated products for various IoT segments. This commitment to a unified architecture allows Qualcomm to offer scalability that is very attractive to manufacturers, who can design a range of products with different performance levels without having to start from scratch for each one.
To complete the offering, Qualcomm has already confirmed that SOM modules based on these processors will be showcased at IFA 2026, and that it has already begun an early access program with select customers. Developer evaluation kits are expected to be available by early 2027. With all this, the company aims to make the development of edge AI devices increasingly accessible and less expensive, paving the way for a new generation of products that could change how we interact with technology in our daily lives and at the heart of industry.
The arrival of these processors comes at a time when Qualcomm is intensifying its presence in the industrial AI and robotics market, even beyond mobile processors. At a recent event, the Qualcomm Dragonwing IoT Day, the company already demonstrated its interest in strengthening its ecosystem with partners and customers such as Samsung, LG, and Hyundai. With the new Q-2390 and IQ-2390, the company is rounding out its strategy of offering processing solutions for a very broad spectrum of devices, always with an eye toward a future where artificial intelligence is present in every corner of our homes and factories.
